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"A low-overhead fault tolerance scheme for TSV-based 3D network on chip links."

Igor Loi et al. (2008)

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DOI: 10.1109/ICCAD.2008.4681638

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  - conf/iccad/LoiMLFB08
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  - https://dblp.org/rec/conf/iccad/LoiMLFB08
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu Fujita, Luca Benini:
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links. ICCAD 2008: 598-602

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