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"Integration of CNT in TSV (≤5 μm) for 3D IC application and its ..."
Kaushik Ghosh et al. (2013)
- Kaushik Ghosh, C. C. Yap, Beng Kang Tay, Chuan Seng Tan:
Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges. 3DIC 2013: 1-4
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