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Jin-Ye Juang

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2010 – 2019

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2013
[j2]
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  - journals/mr/ChangPYCCZJH13
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  - https://dblp.org/rec/journals/mr/ChangPYCCZJH13
Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang:
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps. Microelectron. Reliab. 53(1): 41-46 (2013)

2000 – 2009

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2008
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Chun-Chih Chuang, Tsung-Fu Yang, Jin-Ye Juang, Yin-Po Hung, Chau-Jie Zhan, Yu-Min Lin, Ching-Tsung Lin, Pei-Chen Chang, Tao-Chih Chang:
Influence of underfill materials on the reliability of coreless flip chip package. Microelectron. Reliab. 48(11-12): 1875-1881 (2008)

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