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Lucile Arnaud
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2020 – today
- 2022
- [c10]Aziliz Le Clainche
, Camille Nasarre
Apocalypse Dog. SIGGRAPH Asia Computer Animation Festival 2022: 9:1 - 2021
- [j3]Pascal Vivet
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - [c9]Christophe Dubarry
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 3DIC 2021: 1-4 - 2020
- [c8]Pascal Vivet
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48
2010 – 2019
- 2019
- [c7]Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné:
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. 3DIC 2019: 1-4 - 2018
- [c6]Imed Jani, Didier Lattard, Pascal Vivet
BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. ETS 2018: 1-6 - [c5]Lucile Arnaud, Stéphane Moreau
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4 - 2016
- [c4]Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-2 - [c3]Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-5 - [c2]Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau
ITAC: A complete 3D integration test platform. 3DIC 2016: 1-4 - 2015
- [c1]Giulio Marti, Lucile Arnaud, David Ney, Yves Wouters
Interconnect design study for electromigration reliability improvement. IRPS 2015: 2 - 2014
- [j2]Giulio Marti, Lucile Arnaud, Yves Wouters
Study of EM void nucleation and mechanic relaxation effects. Microelectron. Reliab. 54(9-10): 1692-1696 (2014) - 2013
- [j1]Thomas Frank, Stéphane Moreau
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53(1): 17-29 (2013)
Coauthor Index
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