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C. Y. Khor

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2020 – today

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2024
[j12]
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  - journals/computation/FaizalKSHAMH24
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W. M. Faizal, C. Y. Khor, Suhaimi Shahrin, M. H. M. Hazwan, M. Ahmad, M. N. Misbah, A. H. M. Haidiezul:
Computational Fluid Dynamics Analysis of Varied Cross-Sectional Areas in Sleep Apnea Individuals across Diverse Situations. Comput. 12(1): 16 (2024)
2020
[j11]
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  - journals/cmpb/FaizalGKBZYIR20
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W. M. Faizal, Nik Nazri Nik Ghazali, C. Y. Khor, Irfan Anjum Badruddin, M. Z. Zainon, Aznijar Ahmad Yazid, Norliza Binti Ibrahim, Roziana M. Razi:
Computational fluid dynamics modelling of human upper airway: A review. Comput. Methods Programs Biomed. 196: 105627 (2020)

2010 – 2019

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2019
[j10]
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W. M. Faizal, Nik Nazri Nik Ghazali, Irfan Anjum Badruddin, M. Z. Zainon, Aznijar Ahmad Yazid, Mohamad Azlin Bin Ali, C. Y. Khor, Norliza Binti Ibrahim, Roziana M. Razi:
A review of fluid-structure interaction simulation for patients with sleep related breathing disorders with obstructive sleep. Comput. Methods Programs Biomed. 180 (2019)
2015
[j9]
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  - journals/simpra/AzizAKA15
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M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid:
Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. Simul. Model. Pract. Theory 57: 45-57 (2015)
2014
[j8]
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C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz:
Influence of solder bump arrangements on molded IC encapsulation. Microelectron. Reliab. 54(4): 796-807 (2014)
[j7]
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C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid:
Recent fluid-structure interaction modeling challenges in IC encapsulation - A review. Microelectron. Reliab. 54(8): 1511-1526 (2014)
2013
[j6]
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C. Y. Khor, Mohd Zulkifly Abdullah:
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. Microelectron. Reliab. 53(2): 334-347 (2013)
[j5]
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  - journals/mr/LeongAK13
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W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor:
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. Microelectron. Reliab. 53(12): 1996-2004 (2013)
2012
[j4]
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C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan:
Investigation of the fluid/structure interaction phenomenon in IC packaging. Microelectron. Reliab. 52(1): 241-252 (2012)
[j3]
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W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor:
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. Microelectron. Reliab. 52(4): 744-756 (2012)
[j2]
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C. Y. Khor, Mohd Zulkifly Abdullah:
Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology. Simul. Model. Pract. Theory 29: 109-122 (2012)
2010
[j1]
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  - journals/mr/KhorMAA10
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C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani:
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. Microelectron. Reliab. 50(1): 98-105 (2010)

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